Capabilities Of LED Assembly

Marktech Optoelectronics offers a comprehensive range of Engineering and Manufacturing services that simplify LED product development and provide meaningful time and cost savings to OEM customers. Our vertically-integrated services provide customers with a total design, manufacturing, and logistics solution that move a product from its initial design through volume production, test, and distribution. These integrated services allow us to design, build, and ship a complete product efficiently, effectively and at a greater cost savings to our customers.

Marktech Manufacturing Facility

Schematic Capture, PCB Layout and Design, Simulation, CAD, CAM. Surface Mount, Thru-Hole, COB (Chip on Board), Manual and Automated Assembly, Virtual Tour Of The Facilities

Manufacturing Capabilities

Please see the links below for detailed information on our LED Assembly Capabilities. If you do not find what you are looking for or have additional questions please feel free to contact us at info@marktechopto.com or call 800.984.5337 to speak with a technical sales representative.

• LED Assemblies Technologies
  • Surface Mount
  • Thru-Hole
  • Mixed Technology
  • Chip-on-Board assembly
• High Density Pick & Place
• Prototyping
• High Volume Production Runs
• Wave, Reflow, Hand and Dip Soldering expertise
• PCB Design and Fabrication
  • Single or Multi Layer
  • Flexible or Rigid
  • Aluminum, FR-4 and Polyimide
• Eng. Software Capabilities
  • Schematic Capture
  • PCB Design
  • Simulation
  • CAD & CAM
• Microcontroller/IC programming
• Consigned or purchased materials
• In-circuit testing
• GenRad functional testing
• Reliability testing
• Potting
• Conformal Coating
• Wire & Cable Assembly
• IPC Standard Assembly
• Use of your Part Numbering System
• Shipped according to your packaging requirements
• Additional Outsourced Capabilities include...
  • Plastic injection molding
  • Metal work fabrication